Liquid Cooled Multiple Platform Enclosures GTFSDMPE1

Parker’s SprayCool® multiple platform enclosure (MPE) series of enclosures utilize the efficiency of evaporative (two phase) cooling using a patented direct spray technology and a di-electric fluid.

The SprayCool® multiple platform enclosure (MPE) series offers a new standard of scalable thermal performance, environmental isolation, and flexible design that simplifies integration while meeting today’s and tomorrow’s needs in harsh environments. The enclosures incorporate a closed-loop liquid cooling system.

Using patented direct-spray evaporative technology, electronics are protected in the MPE’s sealed, closed-loop environment, ensuring electronics survivability in extreme operating environments, encompassing both temperature and vibration. Architected to reduce no-recurring engineering expenses for custom products, the MPE can be delivered in any payload configuration without mission-specific development.

The SprayCool MPE series features small, lightweight, rugged, high-performance, direct-spray enclosures. Designed to provide unparalleled flexibility, the MPE can enable survivability for both commercial grade and rugged electronics in harsh military environment applications.

Leveraging open-industry standards and common commercial-grade electronics, the MPE enclosure allows you to quickly field common applications without redesign or requalification across a range of vehicle types or applications. The MPE series is available in 3U and 6U formats and capable of supporting any IEEE1101.2 format backplane.

APPLICATIONS:
Airborne, UAV, Rotor-wing aircraft, and ground vehicle platforms employing:
• Sensor processing
• Electronic warfare
• Mission computing
• Command and control
• Directed energy management

FEATURES AND ATTRIBUTES:
• Meets demanding environmental requirements of MIL-STD-810F
• Supports MIL-STD-704 & 1275B power inputs
• Electro-magnetic interference (EMI) per MIL-STD-461 and MIL-STD-462
• Sealed Construction prevents moisture and dust contamination
• Supports multiple Open Architecture Systems EG cPCI, VME and VPX
• Configurable I/O, backplane and power supply
• No air filters or other frequent maintenance items
• Capable of cooling a two kilowatt heat load
• Scalable up to 11 3U 0.8” spaced slots and up 21 6U 0.8” spaced slots
• Available in 1” pitch versions to support VPX
• Supports self-diagnosis and built-in test (BIT)

OPTIONAL FEATURES:
• Optional mounting features including shock isolation
• Operating altitude up to 75,000 feet
• A range of sizes and configurations
• Scalable slots, up to 11 3U 0.8” and up to 21 6U 0.8”

Характеристики